Cooling sheet for pillow

ABSTRACT

A cooling sheet for pillow includes a plurality of thermoelectric coolers, a thermal pad, and a heat sink. The thermoelectric coolers are electrically connected one another in series, with a first junction and a second junction. The thermal pad is thermally connected to the first junction of the thermoelectric coolers. The heat sink is thermally connected to the second junction of the thermoelectric coolers. The thermal pad is adapted to be used with a pillow, and the temperature of the thermal pad is controlled by the thermoelectric coolers. The thermoelectric coolers include first and second metals that are dissimilar from the first metal. The first and second metals are connected to each other at two junctions forming Peltier junctions. The thermoelectric coolers further include an EMF source for providing electric current through the Peltier junctions. The thermoelectric coolers can be realized by two dissimilar semiconductors.

BACKGROUND OF THE INVENTION

The present invention relates to a cooling sheet for pillow.

More particularly, this invention relates to a cooling sheet thatcontrols the temperature of the pillow.

Still more specifically, the invention relates a cooling sheet usingPeltier effects.

Sleeping is an important and complicated biological process people gothrough almost ritually every night.

Sound and good sleep does not come easily to some people. There are manyspecial ways to lead to a good-night sleep, which are resulted from thepsychological or elctrophysiological researches.

In contrast, there are also common-sense wisdoms. For example, a cozyand comfortable bedroom might be a good starting. Sometimes and for somepeople, a delicate sectional control of temperature of their body is oneof the necessary conditions for a good sleep; cool head or warm feet.

Accordingly, a need for a cooling sheet for pillow has been present fora long time. This invention is directed to solve these problems andsatisfy the long-felt need.

SUMMARY OF THE INVENTION

The present invention contrives to solve the disadvantages of the priorart.

An object of the invention is to provide a cooling sheet for pillow.

Another object of the invention is to provide a cooling sheet that coolsthe pillow.

Still another object of the invention is to provide a cooling sheetusing a thermoelectric coolers operated by the Peltier effect.

A cooling sheet for pillow includes a plurality of thermoelectriccoolers, a thermal pad, and a heat sink cooled by a cooling fan.

The thermoelectric coolers are electrically connected one another inseries or in parallel, with a first junction and a second junction.

The thermal pad is thermally connected to the first junction of thethermoelectric coolers.

The heat sink is thermally connected to the second junction of thethermoelectric coolers.

The thermal pad is adapted to be used with a pillow, and the temperatureof the thermal pad is controlled by the thermoelectric coolers.

The thermoelectric coolers include a first metal and a second metal thatis dissimilar from the first metal.

The first metal and the second metal are connected to each other at twojunctions forming Peltier junctions.

The thermoelectric coolers further include an EMF source for providingelectric current through the Peltier junctions.

The second metal includes a primary second metal and a secondary secondmetal, and the EMF source is inserted in between the primary andsecondary second metals.

The first junction, which is connected to the thermal pad, is a coolingjunction.

Alternatively, the thermoelectric coolers may include a firstsemiconductor and a second semiconductor that is dissimilar from thefirst semiconductor. The first semiconductor and the secondsemiconductor are connected to each other at two junctions formingPeltier junctions.

Each of the semiconductors includes a p-type semiconductor and an n-typesemiconductor.

The thermal pad is made of material of high thermal conductivity,preferably metal.

The material of high thermal conductivity includes a braided metal sheetstructure for increasing the thermal conduction area.

The heat sink is made of metal of high thermal conductivity. The metalincludes aluminum.

The cooling sheet may further include a power supply, a controller, acooling fan, and a power switch.

The controller is for controlling the amount of electric current throughthe thermoelectric coolers, eventually controlling the temperature ofthe first junction.

The cooling fan includes a variable switch for controlling the speed ofthe cooling fan; controlling the level of noise of the cooling fan.

The advantages of the present invention are: (1) the cooling sheet isconvenient to use; (2) the cooling sheet helps to control a sectionalbody temperature; and (3) the cooling sheet can be a cooler for pillowand others.

Although the present invention is briefly summarized, the fullerunderstanding of the invention can be obtained by the followingdrawings, detailed description and appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the presentinvention will become better understood with reference to theaccompanying drawings, wherein:

FIG. 1 is a top plan view of a cooling sheet for a pillow according tothe present invention;

FIG. 2 is a schematic diagram of a pair of Peltier junctions of FIG. 1;

FIG. 3 is a block diagram showing the cooling sheet according to theinvention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 shows a top plan view of a cooling sheet 100 for a pillow (notshown).

The cooling sheet 100 for pillow includes a plurality of thermoelectriccoolers 10, a thermal pad 20, and a heat sink 30.

The thermoelectric coolers 10 are electrically connected one another inseries or in parallel, with a first junction 11 and a second junction12.

The thermal pad 20 is thermally connected to the first junction 11 ofthe thermoelectric coolers 10.

The heat sink 30 is thermally connected to the second junction 12 of thethermoelectric coolers 10.

The thermal pad 20 is adapted to be used with a pillow, and thetemperature of the thermal pad 20 is controlled by the thermoelectriccoolers 10. The pillow can be put on the thermal pad 20. Alternatively,the thermal pad 20 can be integrated into the pillow.

As shown in FIG. 2, the thermoelectric coolers 10 include a first metal13 and a second metal 14 that is dissimilar from the first metal 13.

The first metal 13 and the second metal 14 are connected to each otherat two junctions 11, 12 forming Peltier junctions.

The thermoelectric coolers 10 further include an EMF source 15 forproviding electric current through the Peltier junctions 11, 12.

The second metal 14 includes a primary second metal 141 and a secondarysecond metal 142, and the EMF source 15 is inserted in between theprimary and secondary second metals 141, 142.

The first junction 11, which is connected to the thermal pad 20, is acooling junction for cooling down the pillow.

Alternatively, the thermoelectric coolers 10 include a firstsemiconductor and a second semiconductor that is dissimilar from thefirst semiconductor. The first semiconductor and the secondsemiconductor are connected to each other at two junctions formingPeltier junctions. Each of the semiconductors includes a p-typesemiconductor and an n-type semiconductor.

The thermal pad 20 is made of material of high thermal conductivity,preferably metal. The material of high thermal conductivity includes abraided metal sheet structure 22 for increasing the thermal conductionarea as shown in FIG. 1.

The heat sink 30 is made of metal of high thermal conductivity. Themetal includes aluminum.

The cooling sheet 100 may further include a power supply 50, acontroller 60, a cooling fan 70, and a power switch 80.

The controller 60 is for controlling the amount of electric currentthrough the thermoelectric coolers 10, eventually controlling thetemperature of the first junction 11 and the temperature of the thermalpad 20.

The cooling fan 70 includes a variable switch 72 for controlling thespeed of the cooling fan 70; controlling the noise level of the coolingfan 70.

The thermoelectric coolers 10 can achieve temperature difference betweenthe first and second junctions 11, 12 up to 70 degrees in Celsius, orcan transfer heat at a rate of 138 W. To achieve greater temperaturedifferences, up to 131 degrees in Celsius, multistage or cascadethermoelectric coolers can be used.

Unlike the cooling fan and the like, the cooling sheet 100 emitsvirtually no noise. Also, it has the reduced space, size, and weightcompared to other type of cooling devices.

While the invention has been shown and described with reference todifferent embodiments thereof, it will be appreciated by those skilledin the art that variations in form, detail, compositions and operationmay be made without departing from the spirit and scope of the inventionas defined by the accompanying claims.

1. A cooling sheet for pillow comprising: a) a plurality ofthermoelectric coolers in series or in parallel with a first junctionand a second junction; b) a thermal pad thermally connected to the firstjunction of the thermoelectric coolers; and c) a heat sink thermallyconnected to the second junction of the thermoelectric coolers, whereinthe thermal pad is adapted to be used with a pillow, wherein thetemperature of the thermal pad is controlled by the thermoelectriccoolers.
 2. The cooling sheet of claim 1, wherein the thermoelectriccoolers comprises: a) a first metal; and b) a second metal dissimilarfrom the first metal, wherein the first metal and the second metal areconnected to each other at two junctions forming Peltier junctions. 3.The cooling sheet of claim 2, wherein the thermoelectric coolers furthercomprises an EMF source for providing electric current through thePeltier junctions.
 4. The cooling sheet of claim 3, wherein the secondmetal comprises a primary second metal and a secondary second metal,wherein the EMF source is inserted in between the primary and secondarysecond metals.
 5. The cooling sheet of claim 1, wherein the firstjunction is a cooling junction.
 6. The cooling sheet of claim 1, whereinthe thermoelectric coolers comprises: a) a first semiconductor; and b) asecond semiconductor dissimilar from the first semiconductor, whereinthe first semiconductor and the second semiconductor are connected toeach other at two junctions forming Peltier junctions.
 7. The coolingsheet of claim 6, wherein each of the semiconductors comprises a p-typesemiconductor and an n-type semiconductor.
 8. The cooling sheet of claim1, wherein the thermal pad is made of material of high thermalconductivity.
 9. The cooling sheet of claim 8, wherein the material ofhigh thermal conductivity comprises metal.
 10. The cooling sheet ofclaim 8, wherein the material of high thermal conductivity comprises abraided metal sheet structure.
 11. The cooling sheet of claim 1, whereinthe heat sink is made of metal of high thermal conductivity.
 12. Thecooling sheet of claim 11, wherein the metal comprises aluminum.
 13. Thecooling sheet of claim 1, further comprising: a) a power supply; b) acontroller for controlling the amount of electric current through thethermoelectric coolers; c) a cooling fan for cooling the heat sink; andd) a power switch for the power supply.
 14. The cooling sheet of claim13, wherein the cooling fan comprises a variable switch, wherein thevariable switch controls the speed of the cooling fan.